Packaging in Microelectronics I/II – Microelectronics

Electronic Packaging Expertise for Modern Microelectronic Systems: Gain a practice-oriented understanding of packaging technologies for semiconductor devices and systems, from bonding processes and circuit board fabrication to surface technologies and interposer solutions in microelectronics.

auf Anfrage

2.035,00 €

Inhalte & Beschreibung

Trends in electronic packaging
Packaging technologies for semiconductor devices and systems
Thin-film & Thick-film technologies
Printed circuit board (PCB) and interposer technologies
Surface technologies for electronic components

Lernziele und Kompetenzen

Students are able

to know the basic principles of electronic device assembly and of circuit board and interposer fabrication
to understand the theoretical fundamentals of bonding technologies like bonding, soldering, welding and gluing as well as of subtractive and additive patterning techniques for circuit boards/interposer
to apply this knowledge to microelectronic devices, printed circuit boards and electronic systems.

Zielgruppe & Voraussetzungen

This course is designed for:

Working engineers
Industrial engineers
Professionals in microelectronics, electronics manufacturing, supply chain, production, industrial engineering, or technical project management
Working professionals with management experience and a technical background
Applicants with existing Valid residency status and a realistic opportunity to demonstrate professional experience during their studies

Admission requirements Suitable professional or technical background In principle, a course can be taken without admission requirements for the master’s program. When applying to participate in a course, please describe your educational background and professional experience. Depending on this, we will invite you to a consultation appointment or, if you are directly admitted, send you a module contract.

Anbieterinformationen

Dresden International University (DIU) Dresden International University is an affiliated partner of TUD (University of Technology Dresden) and has been synonymous with academic continuing higher education for over 20 years. The university is state-recognized, non-profit, and offers accredited degrees. The institution combines personal support, excellent teaching, and experienced lecturers with a lively network of science and practice. Study formats are designed to be modular, agile, and digital. In the departments of Management & Legal, Engineering & Technology, and Life Science, DIU develops future skills through both national and international programs. The university is geared toward individuals with specific goals, ambitious professionals, international talents, and companies looking to develop the skills of their employees. Excellence connects. www.di-uni.de

Organisatorische Informationen

Part time, approx. 6 months Language: English and German Consultation: Ramona Nitzsche, StudyAdvisory Team, studyadvisory@di-uni.de

Lecturers:

Scientific Director
Experts
Professors
Dresden International University Network (e.g TUD University of Technology Dresden, Silicon Saxony, Dresden-Concept e.V.)

Für mehr Informationen zum Kurs:

Packaging in Microelectronics Course | Microelectronics Continuing Education